Helion Signs Letter of Intent For $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D To Support Fusion Energy helionenergy.com

Helion signed a letter of intent with the U.S. Department of Commerce for up to $175 million in CHIPS R&D funding, alongside $50 million in private investment, to develop high-voltage semiconductors and manufacturing capabilities for its fusion systems. The work includes more than $100 million for research and advanced packaging in Everett, Washington, and about $80 million for semiconductor tooling and process development with an industry partner in Burlington, Vermont.